The software tool OpenFOAM is used extensively in the HPC sector to create simulations. It includes hundreds of applications that can be extended and customised, which means it is often used to create simulations in many industries and academic, research and scientific institutions.
However, it is widely known to have challenging I/O patterns. These can slow down work, hampering the progress of work and research.
To uncover the reasons why, we profiled OpenFOAM with the Ellexus I/O profiling tools on the Oracle bare metal cloud. The results detailed in this whitepaper provide a clear picture about why the tool performs slowly at times and highlight key areas for improvement.